SMT Production Line
- Scheduling systemOne shift
- Manpower configuration10 person
CM2
Specification
| Specification | PCB 460x360mm |
|---|---|
| Production parts range | 0201 chip BGA 0.3mm |
| 3σMounting accuracy | ±50μm |
| Daily capacity | 713,000 chip |
Configuration and description of each production line
| LINE | Loader | Printer | Mounter | Mounter | Mounter | N2 reflow | Unloader |
|---|---|---|---|---|---|---|---|
| CM2 | Ascentex | EKRA | ASM | ASM | Panasonic | Chun Chi | Ascentex |
| CM2 | LD330 | X5 | D2 | D1 | CM101-D | ST-8010RN | ULD330 |
CM3
Specification
| Specification | PCB 510x460mm |
|---|---|
| Production parts range | 01005 chip BGA 0.25mm |
| 3σMounting accuracy | ±25μm |
| Daily capacity | 1,958,000 chip |
Configuration and description of each production line
| LINE | Loader | Printer | SPI(3D) | Mounter | N2 reflow | AOI(3D) | Unloader |
|---|---|---|---|---|---|---|---|
| CM3 | Ascentex | EKRA | TRI | ASM | Vitronics | TRI | Ascentex |
| CM3 | LD330 | X5 | TR7007 SII Plus | TX2I*3 | XPM3i | TR7700QE | ULD330 |
DIP production line
- Scheduling systemOne shift
- Manpower configuration17 person
Configuration and description of each production line
| Insertion line | Lead-free wave soldering | Production line |
|---|---|---|
| 6M | JYI DIANN | 12M |
| 6M | JT-120650THL | 12M |
Assembly line
- Scheduling systemOne shift
- Manpower configuration16 person
Other equipment
3D SPI
2D AOI(5pcs)
PCBA Breakout equipment (2pcs)
ICT(2pcs)
X-ray
Optical microscope (2pcs)
BGA rework equipment